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  1. AU="Kotsubo, Vincent Y"
  2. AU="Sladek, Frances M"
  3. AU="Sevillya, Gur"
  4. AU="Jia, Jinhui"
  5. AU="Valero, Sergi"
  6. AU="Lu, Chia-Jung"
  7. AU="Patel, Nakul"
  8. AU=Cerdena Jessica P
  9. AU="Cano, Suzana Faria"
  10. AU="Richardson, Kathryn"
  11. AU="Tsourouflis, Gerassimos"
  12. AU="Srai, S K"
  13. AU="Or, Charles C-F"
  14. AU="Rohin, Francis"
  15. AU="Natália Pinto de Almeida"
  16. AU="Spagnolo-Allende, Antonio J"
  17. AU="Jenninger, B"
  18. AU="Kerenza Hood"
  19. AU="Khan Chachar, Aijaz Zeeshan"
  20. AU="Yuan, Weiming"

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Artikel: Design of a 3000-Pixel Transition-Edge Sensor X-Ray Spectrometer for Microcircuit Tomography.

Szypryt, Paul / Bennett, Douglas A / Boone, William J / Dagel, Amber L / Dalton, Gabriella / Doriese, W Bertrand / Durkin, M / Fowler, Joseph W / Garboczi, Edward J / Gard, Johnathon D / Hilton, Gene C / Imrek, Jozsef / Jimenez, Edward S / Kotsubo, Vincent Y / Larson, Kurt / Levine, Zachary H / Mates, John A B / McArthur, Daniel / Morgan, Kelsey M /
Nakamura, Nathan / O'Neil, Galen C / Ortiz, Nathan J / Pappas, Christine G / Reintsema, Carl D / Schmidt, Daniel R / Swetz, Daniel S / Thompson, Kyle R / Ullom, Joel N / Walker, Christopher / Weber, Joel C / Wessels, Abigail L / Wheeler, Jason W

IEEE transactions on applied superconductivity : a publication of the IEEE Superconductivity Committee

2019  Band 31, Heft 5

Abstract: Feature sizes in integrated circuits have decreased substantially over time, and it has become increasingly difficult to three-dimensionally image these complex circuits after fabrication. This can be important for process development, defect analysis, ... ...

Abstract Feature sizes in integrated circuits have decreased substantially over time, and it has become increasingly difficult to three-dimensionally image these complex circuits after fabrication. This can be important for process development, defect analysis, and detection of unexpected structures in externally sourced chips, among other applications. Here, we report on a non-destructive, tabletop approach that addresses this imaging problem through x-ray tomography, which we uniquely realize with an instrument that combines a scanning electron microscope (SEM) with a transition-edge sensor (TES) x-ray spectrometer. Our approach uses the highly focused SEM electron beam to generate a small x-ray generation region in a carefully designed target layer that is placed over the sample being tested. With the high collection efficiency and resolving power of a TES spectrometer, we can isolate x-rays generated in the target from background and trace their paths through regions of interest in the sample layers, providing information about the various materials along the x-ray paths through their attenuation functions. We have recently demonstrated our approach using a 240 Mo/Cu bilayer TES prototype instrument on a simplified test sample containing features with sizes of ∼ 1
Sprache Englisch
Erscheinungsdatum 2019-10-11
Erscheinungsland United States
Dokumenttyp Journal Article
ISSN 1051-8223
ISSN 1051-8223
DOI 10.1109/tasc.2021.3052723
Datenquelle MEDical Literature Analysis and Retrieval System OnLINE

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