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  1. Book: 3D IC integration and packaging

    Lau, John H

    2015  

    Author's details John H. Lau
    Keywords Microelectronic packaging ; Three-dimensional integrated circuits
    Language English
    Size 458 S., Ill., graph. Darst.
    Publisher McGraw-Hill Education
    Publishing place New York
    Document type Book
    Note Includes bibliographical references and index
    ISBN 0071848061 ; 9780071848060 ; 9780071848077 ; 007184807X
    Database Library catalogue of the German National Library of Science and Technology (TIB), Hannover

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  2. Book: Advanced MEMS packaging

    Lau, John H

    (Electronic engineering)

    2010  

    Author's details John H. Lau
    Series title Electronic engineering
    Keywords Microelectromechanical systems ; Microelectronic packaging
    Language English
    Size XXIII, 552 S., Ill., graph. Darst.
    Publisher McGraw-Hill
    Publishing place New York u.a.
    Document type Book
    Note Literaturangaben
    ISBN 0071626239 ; 9780071626231
    Database Library catalogue of the German National Library of Science and Technology (TIB), Hannover

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  3. Article: Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications.

    Lee, Tzu-Nien / Lau, John-H / Ko, Cheng-Ta / Xia, Tim / Lin, Eagle / Yang, Kai-Ming / Lin, Puru-Bruce / Peng, Chia-Yu / Chang, Leo / Chen, Jia-Shiang / Fang, Yi-Hsiu / Liao, Li-Yueh / Charn, Edward / Wang, Jason / Tseng, Tzyy-Jang

    Materials (Basel, Switzerland)

    2022  Volume 15, Issue 7

    Abstract: In this study, the Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) of the low-loss dielectric material from three different vendors are measured by the Fabry-Perot open resonator (FPOR) technique. Emphasis is placed ... ...

    Abstract In this study, the Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) of the low-loss dielectric material from three different vendors are measured by the Fabry-Perot open resonator (FPOR) technique. Emphasis is placed on the sample preparation, data collection, and the comparison with the data sheet values provided from vendors. A coplanar waveguide with ground (CPWG) test vehicle with one of these raw dielectric materials (vendor 1) is designed (through Polar and simulation) and fabricated. The impedance of the test vehicle is measured by TDR (time-domain reflectometer), and the effective Dk of the test vehicle is calculated by the real cross-section of the metal line width, spacing, and thickness of the test vehicle and a closed-form equation. In parallel, the insertion loss and return loss are measured with the VNA (vector network analyzer) of the test vehicle. Finally, the measurement and simulation results are correlated. Some recommendations on the low-loss dielectric materials of the Dk and Df are also provided.
    Language English
    Publishing date 2022-03-24
    Publishing country Switzerland
    Document type Journal Article
    ZDB-ID 2487261-1
    ISSN 1996-1944
    ISSN 1996-1944
    DOI 10.3390/ma15072396
    Database MEDical Literature Analysis and Retrieval System OnLINE

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  4. Article ; Online: Comparative performance of two commercial sample-to-result systems for hepatitis C virus quantitation and genotyping.

    Yip, Cyril C Y / Sridhar, Siddharth / Lau, John H N / Cheng, Andrew K W / Leung, Kit-Hang / Chen, Jonathan H K / Chan, Kwok-Hung / Cheng, Vincent C C / Yuen, Kwok-Yung

    Expert review of molecular diagnostics

    2020  Volume 20, Issue 12, Page(s) 1253–1258

    Abstract: Objectives: Accurate assays for hepatitis C virus (HCV) quantitation and genotyping are important for the management of HCV infection. In this study, we evaluated the performance of cobas HCV and cobas HCV GT assays (Roche) for HCV quantitation and ... ...

    Abstract Objectives: Accurate assays for hepatitis C virus (HCV) quantitation and genotyping are important for the management of HCV infection. In this study, we evaluated the performance of cobas HCV and cobas HCV GT assays (Roche) for HCV quantitation and genotyping on the cobas 4800 System.
    Methods: We compared the performance of the cobas HCV assays with another commercial system (Abbott
    Results: The limit-of-detection of the cobas HCV assay in our center was higher (15 IU/mL) than the manufacturer claim (9.2 IU/mL). The assay showed high analytical specificity, accuracy, precision, and linearity. Performance was congruent with the RealTi
    Conclusion: Our results confirm that the cobas 4800 System is a reliable platform for HCV quantitation and genotyping. The cobas HCV GT assay is a good choice for genotype 1b/6 endemic areas in east Asia, clearly outperforming the RealTi
    MeSH term(s) Genotype ; Genotyping Techniques/methods ; Genotyping Techniques/standards ; Hepacivirus/genetics ; Hepatitis C/diagnosis ; Hepatitis C/virology ; Humans ; RNA, Viral ; Reagent Kits, Diagnostic ; Real-Time Polymerase Chain Reaction/methods ; Reproducibility of Results ; Sensitivity and Specificity ; Viral Load
    Chemical Substances RNA, Viral ; Reagent Kits, Diagnostic
    Language English
    Publishing date 2020-09-23
    Publishing country England
    Document type Journal Article ; Research Support, Non-U.S. Gov't
    ZDB-ID 2112530-2
    ISSN 1744-8352 ; 1473-7159
    ISSN (online) 1744-8352
    ISSN 1473-7159
    DOI 10.1080/14737159.2020.1820327
    Database MEDical Literature Analysis and Retrieval System OnLINE

    Full text online

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    In stock of ZB MED Cologne/Königswinter

    Zs.A 6073: Show issues Location:
    Je nach Verfügbarkeit (siehe Angabe bei Bestand)
    bis Jg. 2021: Bestellungen von Artikeln über das Online-Bestellformular
    ab Jg. 2022: Lesesaal (EG)

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  5. Book: Electronic packaging

    Lau, John H

    design, materials, process, and reliability

    (Electronic packaging and interconnection series)

    1998  

    Author's details John H. Lau
    Series title Electronic packaging and interconnection series
    Language English
    Size XXIV, 498 S, Ill., zahlr. graph. Darst, 24 cm
    Publisher McGraw Hill
    Publishing place New York u.a.
    Document type Book
    Note Literaturverz. S. 482 - 486. - Literaturangaben
    ISBN 0070371350 ; 9780070371354
    Database Library catalogue of the German National Library of Science and Technology (TIB), Hannover

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  6. Book: Flip chip technologies

    Lau, John H

    (Electronic packaging and interconnection series)

    1996  

    Author's details John H. Lau, ed
    Series title Electronic packaging and interconnection series
    Language English
    Size XXIV, 565 S, Ill., graph. Darst, 23 cm
    Publisher McGraw-Hill
    Publishing place New York, NY u.a.
    Document type Book
    ISBN 0070366098 ; 9780070366091
    Database Library catalogue of the German National Library of Science and Technology (TIB), Hannover

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    Order via subito

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  7. Book: Low cost flip chip technologies

    Lau, John H

    for DCA, WLCSP, and PBGA assemblies

    2000  

    Author's details John H. Lau
    Language English
    Size XXII, 585 S, Ill., graph. Darst, 23 cm
    Publisher McGraw-Hill
    Publishing place New York u.a.
    Document type Book
    Note Literaturangaben
    ISBN 0071351418 ; 9780071351416
    Database Library catalogue of the German National Library of Science and Technology (TIB), Hannover

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  8. Book: Ball grid array technology

    Lau, John H

    (Electronic packaging and interconnection series)

    1995  

    Author's details John H. Lau, ed
    Series title Electronic packaging and interconnection series
    Language Undetermined
    Size XVIII, 636 S, Ill., graph. Darst
    Publisher McGraw-Hill
    Publishing place New York u.a.
    Document type Book
    Note Literaturangaben
    ISBN 007036608X ; 9780070366084
    Database Library catalogue of the German National Library of Science and Technology (TIB), Hannover

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  9. Book: Handbook of fine pitch surface mount technology

    Lau, John H

    1994  

    Author's details edited by John H. Lau
    Language Undetermined
    Size XXIV, 692 S, Ill, 24 cm
    Publisher Van Nostrand Reinhold
    Publishing place New York
    Document type Book
    Note Includes bibliographical references and index
    ISBN 0442012586 ; 9780442012588
    Database Library catalogue of the German National Library of Science and Technology (TIB), Hannover

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  10. Book: Chip on board technologies for multichip modules

    Lau, John H

    1994  

    Author's details ed. by John H. Lau
    Keywords Electronic packaging ; Surface mount technology
    Language Undetermined
    Size XVIII, 555 S, Ill., graph. Darst
    Publisher Van Nostrand Reinhold
    Publishing place New York u.a.
    Document type Book
    Note Includes bibliographical references and index
    ISBN 0442014414 ; 9780442014414
    Database Library catalogue of the German National Library of Science and Technology (TIB), Hannover

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