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  1. Article ; Online: Development and Regulation of Connected Combined Products: Reflections From the Medtech & Pharma Platform Association.

    Kühler, Thomas C / Schoenmakers, Marc / Shergold, Oliver / Affolter, Stephan / Bolislis, Winona Rei / Foster, Ruth / Gardner, Paul / Hruschka, Svenja / Jomini, Thierry / Kaveripakam, Sathish / Mayerhofer, Karl / Scherini, Tomaso / Swierczynska, Marta / Vandal, Gretchen / Fürst-Ladani, Shayesteh

    Clinical therapeutics

    2022  Volume 44, Issue 5, Page(s) 768–782

    Abstract: Purpose: Patients taking a medicinal product in a homecare setting typically use a medical device to facilitate the injection process. Reductions in wireless connectivity costs, combined with the rapid adoption of smartphones with connectivity to cloud- ... ...

    Abstract Purpose: Patients taking a medicinal product in a homecare setting typically use a medical device to facilitate the injection process. Reductions in wireless connectivity costs, combined with the rapid adoption of smartphones with connectivity to cloud-based services, are enabling these drug delivery devices to now be connected to a digital ecosystem as connected combined products (CCPs). The purposes of this article are to identify the challenges in developing and releasing these products when they straddle different regulatory frameworks and standards and to highlight gaps in the European Union regulations.
    Methods: Industry subject matter experts from pharmaceutical, medical device, and consultancy companies, who are members of the Medtech & Pharma Platform Association, formed 4 working groups to address current best practice for developing and releasing CCPs and the different relevant regulatory frameworks. The 4 areas studied were clinical and regulatory, usability and human factors engineering, development and life cycle management, and cybersecurity.
    Findings: Development teams require new skills to create innovative products that have a good safety profile and are simple to use, such as design thinking to understand user needs and systems engineering to manage complexity and ensure interoperability. Risk management process should integrate cybersecurity, data privacy, and data integrity, whereas design control processes should enable asynchronous development cycles for hardware and software components. Regulatory frameworks exist for individual components within the CCP. However, for a complex product, regulatory guidance is needed when combining components with different risk and safety profiles and to ensure that the responsibilities and liabilities of companies contributing components are clear. The efficient management of software changes and product updates, as well as dealing with end-of-life hardware and backward compatibility to older software versions, needs agile approaches when it comes to regulatory updates.
    Implications: The regulatory uncertainties and development processes outlined in this article need to be addressed. We call for joint discussions among the various stakeholders in the fields of medicinal products, medical devices, and in vitro diagnostics, as well as standalone software, data protection, and cybersecurity experts, together with regulators and lawmakers in the European Union to meet in focused discussion groups with the aim of devising pragmatic solutions and regulations for the benefit of the sector and hence the patients it serves.
    MeSH term(s) Ecosystem ; Humans ; Pharmaceutical Preparations
    Chemical Substances Pharmaceutical Preparations
    Language English
    Publishing date 2022-04-04
    Publishing country United States
    Document type Journal Article ; Review
    ZDB-ID 603113-4
    ISSN 1879-114X ; 0149-2918
    ISSN (online) 1879-114X
    ISSN 0149-2918
    DOI 10.1016/j.clinthera.2022.03.009
    Database MEDical Literature Analysis and Retrieval System OnLINE

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  2. Article: Adhesion promotion of Cu on C by Cr intermediate layers investigated by the SIMS method.

    Mayerhofer, Karl E / Neubauer, Erich / Eisenmenger-Sittner, Christoph / Hutter, Herbert

    Analytical and bioanalytical chemistry

    2002  Volume 374, Issue 4, Page(s) 602–607

    Abstract: Copper-carbon composites are candidate materials for heat sinks for high speed/high-performance electronic components. They combine high thermal conductivity with low density and a tailorable coefficient of thermal expansion (CTE). Because of the low ... ...

    Abstract Copper-carbon composites are candidate materials for heat sinks for high speed/high-performance electronic components. They combine high thermal conductivity with low density and a tailorable coefficient of thermal expansion (CTE). Because of the low wettability of carbon by copper, a thin layer of chromium can be deposited to promote both the adhesion and the thermal contact of copper with the carbon fibers. Therefore, in a first step layers of Cr and Cu were deposited by magnetron sputtering on plane vitreous carbon substrates (Sigradur G), which serve as a model for carbon fibers. From pull-off-adhesion measurements an interlayer thickness of Cr in the range of 2-10 nm was found to provide the optimal adhesion for 1 micro m thick copper overlayers. To model the later serial fabrication of the composite that involves a hot pressing step following the deposition, the C/Cr/Cu samples were heat treated at 800 degrees C under vacuum for 1 h. Adhesion on the heat-treated samples was superior in comparison to the untreated ones. To obtain information about the adhesion mechanism secondary ion mass spectrometry (SIMS) investigations were done on the depth distribution of the main elements copper, chromium, and carbon. Two samples, one as deposited and one subjected to heat treatment after deposition, were compared in this investigation. We found that heat treatment mainly modifies the distribution of Cr in the C/Cr/Cu system.
    Language English
    Publishing date 2002-10
    Publishing country Germany
    Document type Journal Article
    ZDB-ID 1459122-4
    ISSN 1618-2650 ; 1618-2642
    ISSN (online) 1618-2650
    ISSN 1618-2642
    DOI 10.1007/s00216-002-1540-3
    Database MEDical Literature Analysis and Retrieval System OnLINE

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  3. Article: Quantitative SIMS depth profiling of diffusion barrier gate-oxynitride structures in TFT-LCDs.

    Dreer, Sabine / Wilhartitz, Peter / Piplits, Kurt / Mayerhofer, Karl / Foisner, Johann / Hutter, Herbert

    Analytical and bioanalytical chemistry

    2004  Volume 379, Issue 4, Page(s) 599–604

    Abstract: Gate oxynitride structures of TFT-LCDs were investigated by SIMS, and successful solutions are demonstrated to overcome difficulties arising due to the charging effects of the multilayer systems, the matrix effect of the method, and the small pattern ... ...

    Abstract Gate oxynitride structures of TFT-LCDs were investigated by SIMS, and successful solutions are demonstrated to overcome difficulties arising due to the charging effects of the multilayer systems, the matrix effect of the method, and the small pattern sizes of the samples. Because of the excellent reproducibility achieved by applying exponential relative sensitivity functions for quantitative analysis, minor differences in the barrier gate-oxynitride composition deposited on molybdenum capped aluminium-neodymium metallisation electrodes were determined between the centre and the edge of the TFT-LCD substrates. No differences were found for molybdenum-tungsten metallisations. Furthermore, at the edge of the glass substrates, aluminium, neodymium, and molybdenum SIMS depth profiles show an exponential trend. With TEM micrographs an inhomogeneous thickness of the molybdenum capping is revealed as the source of this effect, which influences the electrical behaviour of the device. The production process was improved after these results and the aging behaviour of TFT-LCDs was investigated in order to explain the change in control voltage occurring during the lifetime of the displays. SIMS and TEM show an enrichment of neodymium at the interface to the molybdenum layer, confirming good diffusion protection of the molybdenum barrier during accelerated aging. The reason for the shift of the control voltage was finally located by semi-quantitative depth profiling of the sodium diffusion originating from the glass substrate. Molybdenum-tungsten was a much better buffer for the highly-mobile charge carriers than aluminium-neodymium. Best results were achieved with PVD silicon oxynitride as diffusion barrier and gate insulator deposited on aluminium-neodymium metallisation layers.
    MeSH term(s) Data Display ; Diffusion ; Materials Testing ; Semiconductors ; Silicon Compounds/chemistry ; Spectrometry, Mass, Secondary Ion/methods ; Surface Properties
    Chemical Substances Silicon Compounds
    Language English
    Publishing date 2004-06
    Publishing country Germany
    Document type Journal Article ; Research Support, Non-U.S. Gov't
    ZDB-ID 1459122-4
    ISSN 1618-2650 ; 1618-2642
    ISSN (online) 1618-2650
    ISSN 1618-2642
    DOI 10.1007/s00216-003-2468-y
    Database MEDical Literature Analysis and Retrieval System OnLINE

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  4. Article: Quantitative SIMS depth profiling of diffusion barrier gate-oxynitride structures in TFT-LCDs

    Dreer, Sabine / Wilhartitz, Peter / Piplits, Kurt / Mayerhofer, Karl / Foisner, Johann / Hutter, Herbert

    Analytical and bioanalytical chemistry

    Volume v. 379,, Issue no. 4

    Abstract: Gate oxynitride structures of TFT-LCDs were investigated by SIMS, and successful solutions are demonstrated to overcome difficulties arising due to the charging effects of the multilayer systems, the matrix effect of the method, and the small pattern ... ...

    Abstract Gate oxynitride structures of TFT-LCDs were investigated by SIMS, and successful solutions are demonstrated to overcome difficulties arising due to the charging effects of the multilayer systems, the matrix effect of the method, and the small pattern sizes of the samples. Because of the excellent reproducibility achieved by applying exponential relative sensitivity functions for quantitative analysis, minor differences in the barrier gate-oxynitride composition deposited on molybdenum capped aluminium-neodymium metallisation electrodes were determined between the centre and the edge of the TFT-LCD substrates. No differences were found for molybdenum-tungsten metallisations. Furthermore, at the edge of the glass substrates, aluminium, neodymium, and molybdenum SIMS depth profiles show an exponential trend. With TEM micrographs an inhomogeneous thickness of the molybdenum capping is revealed as the source of this effect, which influences the electrical behaviour of the device.The production process was improved after these results and the aging behaviour of TFT-LCDs was investigated in order to explain the change in control voltage occurring during the lifetime of the displays. SIMS and TEM show an enrichment of neodymium at the interface to the molybdenum layer, confirming good diffusion protection of the molybdenum barrier during accelerated aging. The reason for the shift of the control voltage was finally located by semi-quantitative depth profiling of the sodium diffusion originating from the glass substrate. Molybdenum-tungsten was a much better buffer for the highly-mobile charge carriers than aluminium-neodymium. Best results were achieved with PVD silicon oxynitride as diffusion barrier and gate insulator deposited on aluminium-neodymium metallisation layers.
    Keywords transmission electron microscopy ; electrodes ; quantitative analysis ; aluminum ; molybdenum ; glass ; neodymium ; sodium ; silicon
    Language English
    Document type Article
    ISSN 1618-2642
    Database AGRIS - International Information System for the Agricultural Sciences and Technology

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