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  1. Article: Injection Molding of Encapsulated Diffractive Optical Elements.

    Wagner, Stefan / Treptow, Kevin / Weser, Sascha / Drexler, Marc / Sahakalkan, Serhat / Eberhardt, Wolfgang / Guenther, Thomas / Pruss, Christof / Herkommer, Alois / Zimmermann, André

    Micromachines

    2023  Volume 14, Issue 6

    Abstract: Microstructuring techniques, such as laser direct writing, enable the integration of microstructures into conventional polymer lens systems and may be used to generate advanced functionality. Hybrid polymer lenses combining multiple functions such as ... ...

    Abstract Microstructuring techniques, such as laser direct writing, enable the integration of microstructures into conventional polymer lens systems and may be used to generate advanced functionality. Hybrid polymer lenses combining multiple functions such as diffraction and refraction in a single component become possible. In this paper, a process chain to enable encapsulated and aligned optical systems with advanced functionality in a cost-efficient way is presented. Within a surface diameter of 30 mm, diffractive optical microstructures are integrated in an optical system based on two conventional polymer lenses. To ensure precise alignment between the lens surfaces and the microstructure, resist-coated ultra-precision-turned brass substrates are structured via laser direct writing, and the resulting master structures with a height of less than 0.002 mm are replicated into metallic nickel plates via electroforming. The functionality of the lens system is demonstrated through the production of a zero refractive element. This approach provides a cost-efficient and highly accurate method for producing complicated optical systems with integrated alignment and advanced functionality.
    Language English
    Publishing date 2023-06-09
    Publishing country Switzerland
    Document type Journal Article
    ZDB-ID 2620864-7
    ISSN 2072-666X
    ISSN 2072-666X
    DOI 10.3390/mi14061223
    Database MEDical Literature Analysis and Retrieval System OnLINE

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  2. Article: Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist.

    Janek, Florian / Eichhorn, Nadine / Weser, Sascha / Gläser, Kerstin / Eberhardt, Wolfgang / Zimmermann, André

    Micromachines

    2021  Volume 12, Issue 8

    Abstract: This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ... ...

    Abstract This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ultrathin chips with a daisy chain layout. The contact pads are opened by photolithography using UV direct light exposure. Circular and rectangular openings of 90 µm and 130 µm diameter, respectively, edge length are realized. Commercial inks containing nanoparticular silver and gold are inkjet printed to form conductive tracks between daisy chain structures. Different numbers of ink layers are applied. The track resistances are characterized by needle probing. Silver ink shows low resistances only for multiple layers and 90 µm openings, while gold ink exhibits low resistances in the single-digit Ω-range for minimum two printed layers.
    Language English
    Publishing date 2021-07-21
    Publishing country Switzerland
    Document type Journal Article
    ZDB-ID 2620864-7
    ISSN 2072-666X
    ISSN 2072-666X
    DOI 10.3390/mi12080856
    Database MEDical Literature Analysis and Retrieval System OnLINE

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  3. Article: Feasibility Study of an Automated Assembly Process for Ultrathin Chips.

    Janek, Florian / Saller, Ebru / Müller, Ernst / Meißner, Thomas / Weser, Sascha / Barth, Maximilian / Eberhardt, Wolfgang / Zimmermann, André

    Micromachines

    2020  Volume 11, Issue 7

    Abstract: This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is ... ...

    Abstract This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm.
    Language English
    Publishing date 2020-06-30
    Publishing country Switzerland
    Document type Journal Article
    ZDB-ID 2620864-7
    ISSN 2072-666X
    ISSN 2072-666X
    DOI 10.3390/mi11070654
    Database MEDical Literature Analysis and Retrieval System OnLINE

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