Artikel: Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging.
Materials (Basel, Switzerland)
2023 Band 16, Heft 9
Abstract: This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, ...
Abstract | This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical influencing factors and quantify the effects of each parameter on wafer warpage. The material properties include Young's modulus of the epoxy molding compound before and after the glass transition temperature (Tg) range of 25-35 °C (E |
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Sprache | Englisch |
Erscheinungsdatum | 2023-04-30 |
Erscheinungsland | Switzerland |
Dokumenttyp | Journal Article |
ZDB-ID | 2487261-1 |
ISSN | 1996-1944 |
ISSN | 1996-1944 |
DOI | 10.3390/ma16093482 |
Datenquelle | MEDical Literature Analysis and Retrieval System OnLINE |
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