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  1. Artikel ; Online: Oriented Three-Dimensional Skeletons Assembled by Si

    Wang, Baokai / Wan, Shiqin / Niu, Mengyang / Li, Mengyi / Yu, Chang / Zhao, Zheng / Xuan, Weiwei / Yue, Ming / Cao, Wenbin / Wang, Qi

    Polymers

    2023  Band 15, Heft 22

    Abstract: With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have become of increasing interest. Traditionally, higher filler fractions are required to obtain a high thermal conductivity, but ... ...

    Abstract With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have become of increasing interest. Traditionally, higher filler fractions are required to obtain a high thermal conductivity, but this leads to a decrease in the mechanical properties of the composites and increases the cost. In this study, silicon nitride nanowires (Si
    Sprache Englisch
    Erscheinungsdatum 2023-11-16
    Erscheinungsland Switzerland
    Dokumenttyp Journal Article
    ZDB-ID 2527146-5
    ISSN 2073-4360 ; 2073-4360
    ISSN (online) 2073-4360
    ISSN 2073-4360
    DOI 10.3390/polym15224429
    Datenquelle MEDical Literature Analysis and Retrieval System OnLINE

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  2. Artikel ; Online: Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons

    Hao, Xu / Wan, Shiqin / Zhao, Zheng / Zhu, Lifeng / Peng, Dongyao / Yue, Ming / Kuang, Jianlei / Cao, Wenbin / Liu, Guanghua / Wang, Qi

    ACS Applied Materials & Interfaces. 2022 Dec. 28, v. 15, no. 1 p.2124-2133

    2022  

    Abstract: With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have attracted increasing attention. For regular ceramic particles as fillers, it is necessary to achieve the highest filling fraction ...

    Abstract With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have attracted increasing attention. For regular ceramic particles as fillers, it is necessary to achieve the highest filling fraction to obtain high thermal conductivity, yet leading to higher production cost and reduced mechanical properties. In this paper, AlN whiskers with a high aspect ratio were successfully prepared using a modified direct nitriding method, which was further paired with AlN particles as fillers to prepare the AlN/epoxy composites. It is indicated that AlN whiskers could form bridging links between AlN particles, which favored the establishment of thermal pathways inside the polymer matrix. On this basis, we constructed the 3D AlN skeletons as a thermal conductivity pathway by the freeze-casting method, which could further enhance the thermal conductivity of the composites. The synergistic enhancement effect of 1D AlN whiskers and directional filler skeletons on the composite thermal conductivity was further demonstrated by the actual heat transfer process and finite element simulations. More significantly, the experimental results showed that the addition of one-dimensional fillers could also effectively improve the thermal stability and mechanical properties of the composites, which was beneficial for preparing high-performance TIMs.
    Schlagwörter ceramics ; epoxides ; finite element analysis ; heat transfer ; polymers ; thermal conductivity ; thermal stability ; AlN whiskers ; freeze-casting ; AlN/epoxy composites ; thermal interface materials ; direct nitriding method
    Sprache Englisch
    Erscheinungsverlauf 2022-1228
    Umfang p. 2124-2133.
    Erscheinungsort American Chemical Society
    Dokumenttyp Artikel ; Online
    ISSN 1944-8252
    DOI 10.1021/acsami.2c18356
    Datenquelle NAL Katalog (AGRICOLA)

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  3. Artikel ; Online: Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si

    Wan, Shiqin / Hao, Xu / Zhu, Lifeng / Yu, Chang / Li, Mengyi / Zhao, Zheng / Kuang, Jianlei / Yue, Ming / Lu, Qipeng / Cao, Wenbin / Wang, Qi

    ACS applied materials & interfaces

    2023  Band 15, Heft 27, Seite(n) 32885–32894

    Abstract: As the rapid development of advanced foldable electronic devices, flexible and insulating composite films with ultra-high in-plane thermal conductivity have received increasing attention as thermal management materials. Silicon nitride nanowires ( ... ...

    Abstract As the rapid development of advanced foldable electronic devices, flexible and insulating composite films with ultra-high in-plane thermal conductivity have received increasing attention as thermal management materials. Silicon nitride nanowires (Si
    Sprache Englisch
    Erscheinungsdatum 2023-07-01
    Erscheinungsland United States
    Dokumenttyp Journal Article
    ISSN 1944-8252
    ISSN (online) 1944-8252
    DOI 10.1021/acsami.3c04473
    Datenquelle MEDical Literature Analysis and Retrieval System OnLINE

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    Dieser Service ist kostenpflichtig (siehe Lieferbedingungen von subito). Bestellungen, die einen Artikel nebst Supplementary Material umfassen, werden grundsätzlich wie mehrfache Bestellungen bearbeitet. Gebühren fallen in diesen Fällen für jede einzelne Bestellung an.

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